Page Views: 211 Date Added: 05/30/2011 Last Updated: 05/30/2011 Expiry Date: 05/27/2021 Product/Service Details Name High temperature resistant electronic components encapsulating adhesive（THO4054） Outline This double-component product is epoxy adhesive. It is easy and convenient to use for it solidifies fast at normal temperature and bonds well. No bubbles appear after curing thus making the surface smooth and bright. The series has two categories, room temperature curing and heat curing. Its viscocity, color and heat-resistance quality are adjustable. Applications It applies to the encapsulating electronic components and chips in transformers, rectifiers, AC capacitor, ignition coils, electronic modules, negative ion generator, atomizer, and other products to protect them against moisture, chemicals, excessive heat, vibration, mechanical impact and thermal shocks. Features Component A is pasty, non-solid particle. component B is in tinted paste shape. Fast curing velocity. At 25°C, within 1-3 hours, it is at the early stage of curing, 12 hours later, it reaches its maximum bonding strength. Being durable and resistant to ultraviolet light once the bond has formed. Being heat-resistant, it adapts to a wide range of temperature and bonds well under high temperature. Mix the two components in a certain proportion, apply it to the surface of the substrates directly, which makes it so convenient to use. You'll get long term durability and resistance to moisture, chemicals, oils, and temperature extremes. Non-toxic after solidification, though it is a little smelly. Shelf life is one and half a year. The main technical parameters are as follows: Heat resistance scope：-40°C—+ 380°C volume resistance: 1×10×15Ω.cm sheet resistance 2.5×1015Ω voltage withstand 20-24kV/mm hardness shore D 90 Water absorbing capacity 24h＜0.1% Tg:300-400℃ Cementation intensity: Tensile strength≥25MPa; Shearing strength≥20 MPa Instruction 1. To get the best results, the two surfaces being bonded should be free of oils, dirt, moisture and other contaminants and should be slightly roughed or sanded to remove gloss. 2. Mix A and B in a proportion of 10:1.2--1.5 to get perfect bonding result at fastest speed at 25 °C. 3. Spread the mixture on the substrates, put them together and apply some strength on them, finally, let them dry for 2-4 hours. Notes 1. Use another can or container to blend A with B. The tools used to get A and B should be different. 2. A and B should be mixed well. 3. It is necessary to keep it well ventilated and away from fire. 4. If it has contact with skin, you should wash thoroughly with soap and water. 5. It can be stored at well-ventilated places with low temperature, and keep them away from fire. 6. Cover the lip after using it. Copyright © 2005-2011Thomas Technology, Inc. All Rights Reserved.

Company Information (Thomas Sci Co.,Ltd)

Company Profile: Specializing in developing, manufacturing and marketing adhesives, whose high temperature resistant adhesive enjoys high reputation. Thomas is committed to creating the best for ever products of its field and providing tailored technical support for its customers. Backed up by highly skilled technicians and ongoing researching and developing centers, supported by the experts in the field. Thomas offers innovative products with fabulous versatility of use in many different applications. What Thomas offers isn’t only the best quality professional adhesives, it also supplies you with comprehensive solutions tailored to your specific needs and long-term business strategy and economic schemes.. >> More Website URL: http://www.bridgat.com/u37944